Lenovo is gearing up for the Mobile World Congress (MWC), which kicks off on March 5 in Barcelona, unveiling its latest innovation, the ThinkBook Flip AI PC. After a successful showcase at the Consumer Electronics Show (CES) 2025 in Las Vegas, anticipation is building around this new device.

According to tipster Evan Blass' latest leak, the ThinkBook Flip will feature a flexible screen that expands vertically to reveal additional workspace beneath it. This innovative design allows for various form factors, depending on the user's needs.

The Lenovo ThinkBook Flip is expected to have a similar form factor as the Lenovo ThinkBook Plus introduced at CES 2025, which made waves as the first-ever retail laptop with a rollable display. The upcoming device is rumored to possess the unique ability to bend into a tent-like shape, adding versatility to its functionality.

While specific specifications remain under wraps, sources hint that the laptop will incorporate artificial intelligence (AI) capabilities, potentially being branded as an AI PC. This indicates that it may be powered by leading processors such as the Intel Core Ultra or Snapdragon X Elite, both of which are currently capable of supporting AI features. Moreover, leaked images suggest it will run on Windows 11 and might include a physical keyboard alongside its innovative display.

Lenovo has been active in the showcase of new technology at events like CES 2025, where they introduced several notable devices, including the Lenovo ThinkBook Plus Gen 6 Rollable AI PC with its rollable OLED display. The event also saw the launch of the Lenovo Yoga Slim 9i, featuring an industry-first camera-under-display design on a laptop, alongside other products such as the Lenovo Legion Go S, ThinkPad X9 14 Aura Edition, and ThinkPad X9 15 Aura Edition.